Ball grid array card edge connector
AssigneeIntel Corporation
InventorsXiang Li, Mo Liu, Shaohua Li, Jingbo Li, Kai Xiao
Life of this patent
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AssigneeIntel Corporation
InventorsXiang Li, Mo Liu, Shaohua Li, Jingbo Li, Kai Xiao
Estimating the term…
In one embodiment, a card edge connector includes: a housing having an opening into which a first circuit board is to be inserted; a plurality of pins each having a first end and a second end, the plurality of pins extending from within the opening through a bottom surface of the housing, the first end of the first plurality of pins to mate with a corresponding contact of the first circuit board; and a plurality of ball grid array (BGA) solder balls each adapted at the second end of a corresponding one of the plurality of pins, the plurality of pins to mate with a corresponding conductive area of a second circuit board to which the card edge connector mates via the plurality of BGA solder balls. Other embodiments are described and claimed.
A card edge connector comprising
A system comprising:
A card electromechanical (CEM) connector comprising
Dependencies are inferred from the claim text.