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US 2021/0202441 A1Published application
System and method for stacking wire-bond converted flip-chip die
AssigneeIntel Corporation
InventorsENG HUAT GOH, CHU AUN LIM, UPENDRA R. SHETH, ROBERT STARKSTON
Life of this patent
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Abstract
Various embodiments are generally directed to an electronic assembly comprising at least two dies stacked on top of each other. Metal columns of different heights electrically connect the dies to a system substrate.
Claims26
An electronic assembly comprising:
- a system substrate;
- a first die disposed on and in electrical communication with the system substrate using a first set of first metal columns having a first height;
- a second die disposed on and in electrical communication with the system substrate using a second set of second metal columns having a second height greater than the first height such that at least a portion of the first die is disposed between the second die and the system substrate.
-25. (canceled)
A method for forming an electronic assembly, the method comprising:
- a. forming a first set of first metal columns having a first height on a first die;
- b. forming a second set of second metal columns having a second height greater than the first height on a second die;
- c. depositing an adhesive film on a surface of the second die;
- d. attaching a surface of the first die to the adhesive film;
- e. thermo-compression bonding the first metal columns and second metal columns to a system substrate.
2 more elements
A method for electronically communicating with circuits disposed on a plurality of dies, the method comprising:
- transmitting a first signal from a system substrate through a first set of first metal columns electrically connected to the system substrate and having a first height to a first die electrically connected to the first set of first metal columns;
- transmitting a second signal from a system substrate through a second set of second metal columns electrically connected to the system substrate and having a second height greater than the first height to a second die electrically connected to the second set of second metal columns, at least a portion of the first die being disposed between the second die and the system substrate.
Dependencies are inferred from the claim text.