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US 2021/0202418 A1Published application
Package structure of semiconductor device with improved bonding between the substrates
AssigneeUnited Microelectronics Corp.
InventorsMING-TSE LIN, Chung-Hsing Kuo, Hui-Ling Chen
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Abstract
A package structure of a semiconductor device includes a first substrate, a second substrate, and a bonding layer. The bonding layer bonds the first substrate and the second substrate. The bonding layer includes an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer. The outer bonding pad pattern surrounds the inner bonding pad pattern. A first bonding pad density of the outer bonding pad pattern is greater than a second bonding pad density of the inner bonding pad pattern.
Claims16
A package structure of a semiconductor device, comprising:
- a first substrate;
- a second substrate;
- and
- a bonding layer bonding the first substrate and the second substrate, wherein the bonding layer comprises an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer, and the outer bonding pad pattern surrounds the inner bonding pad pattern,
- wherein a first bonding pad density of the outer bonding pad pattern is greater than a second bonding pad density of the inner bonding pad pattern,
- the inner bonding pad pattern comprises a plurality of first bonding pads, the outer bonding pad pattern comprises a plurality of second bonding pads, and each of the first bonding pads has the same size as each of the second bonding pads.
3 more elements
Dependencies are inferred from the claim text.