Semiconductor device including redistribution layer and method for fabricating the same

Abstract

A semiconductor device includes: a lower structure; a redistribution insulating layer disposed over the lower structure; a redistribution conductive layer disposed over the redistribution insulating layer and electrically connected to a part of the lower structure, the redistribution conductive layer including a redistribution pad; and a protective layer covering the redistribution insulating layer and the redistribution conductive layer while leaving the redistribution pad exposed. The redistribution conductive layer includes a trench disposed adjacent to the redistribution pad, and a part of the protective layer fills the trench.

Dependencies are inferred from the claim text.