US 2021/0202406 A1 · SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Abstract

A semiconductor device package includes a first circuit layer and an emitting device. The first circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device is disposed on the second surface of the first circuit layer. The emitting device has a first surface facing the second surface of the first circuit layer, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device has a conductive pattern disposed on the second surface of the emitting device. The lateral surface of the emitting device and the lateral surface of the first circuit layer are discontinuous.

Claims24

Dependent claims

A semiconductor device package, comprising:

a first circuit layer having a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface;
and
an emitting device disposed on the second surface of the first circuit layer, the emitting device having a first surface facing the second surface of the first circuit layer, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface, the emitting device having a conductive pattern disposed on the second surface of the emitting device,
wherein the lateral surface of the emitting device and the lateral surface of the first circuit layer are discontinuous.

1 more element

Dependencies are inferred from the claim text.

Semiconductor device package and method of manufacturing the same

Life of this patent

Semiconductor device package and method of manufacturing the same

Life of this patent

Abstract

Claims24