US 2021/0202364 A1 · PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Abstract

A package structure including a first circuit board, a second circuit board, an encapsulant, a plurality of conductive terminals, and a package device is provided. The first circuit board has a first top surface and a first bottom surface opposite to each other. The second circuit board has a second top surface and a second bottom surface opposite to each other. The encapsulant encapsulates the first and second circuit boards. The conductive terminals are disposed on the first or second bottom surface and electrically connected to the first or second circuit board. The package device is disposed on the first or second top surface and electrically connected to the first and second circuit boards. The package device includes a first chip, a second chip, a chip encapsulant, a circuit layer, and a plurality of conductive package terminals. A manufacturing method of a package structure is also provided.

Claims17

Dependent claims

A package structure, comprising:

a first circuit board, having a first top surface and a first bottom surface opposite to the first top surface;
a second circuit board, having a second top surface and a second bottom surface opposite to the second top surface;
a first encapsulant, encapsulating the first circuit board and the second circuit board;
a plurality of conductive terminals, disposed on the first bottom surface or the second bottom surface and electrically connected to the first circuit board or the second circuit board;
and
a package device, disposed on the first top surface or the second top surface and electrically connected to the first circuit board and the second circuit board, the package device comprising:
a first chip;
a second chip;
a chip encapsulant, encapsulating the first chip and the second chip;
a circuit layer, located on the chip encapsulant and electrically connected to the first chip and the second chip;
and
a plurality of conductive package terminals, located on the circuit layer and electrically connected to the first circuit board or the second circuit board.

9 more elements

A manufacturing method of a package structure, comprising:

providing a first circuit board having a first top surface and a first bottom surface opposite to the first top surface;
providing a second circuit board having a second top surface and a second bottom surface opposite to the second top surface;
forming a first encapsulant encapsulating the first circuit board and the second circuit board;
disposing a package device on the first top surface or the second top surface, wherein the package device is electrically connected to the first circuit board and the second circuit board, and the package device comprises:
a first chip;
a second chip;
a chip encapsulant, encapsulating the first chip and the second chip;
a circuit layer, located on the chip encapsulant and electrically connected to the first chip and the second chip;
and
a plurality of conductive package terminals, located on the circuit layer and electrically connected to the first circuit board or the second circuit board;
and
forming a plurality of conductive terminals on the first bottom surface or the second bottom surface, wherein the conductive terminals are electrically connected to the first circuit board or the second circuit board.

9 more elements

Dependencies are inferred from the claim text.

Package structure and manufacturing method thereof

Life of this patent

Package structure and manufacturing method thereof

Life of this patent

Abstract

Claims17