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US 2021/0202355 A1Published application
Component Carrier With Low Shrinkage Dielectric Material
AssigneeAT&S (China) Co. Ltd.
InventorsMikael Tuominen, Seok Kim Tay
Life of this patent
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Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. At least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- wherein at least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.
A method of manufacturing a component carrier, wherein the method comprises:
- providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- providing at least part of the at least one electrically insulating layer structure of a material having a curing shrinkage value of less than 2%.
Dependencies are inferred from the claim text.