Semiconductor package for discharging heat generated by semiconductor chip

A semiconductor package, comprising:

• a package substrate;
• a first semiconductor chip on the package substrate and including a first region and a second region;
• a pair of second semiconductor chips spaced apart from each other on the first region;
• a heat radiation spacer on the second region;
• a pair of third semiconductor chips on the pair of second semiconductor chips;
• and
• a molding layer covering the first to third semiconductor chips and the heat radiation spacer,
• wherein each of the third semiconductor chips includes:
• a first segment on a corresponding one of the second semiconductor chips;
• and
• a second segment on the heat radiation spacer.