Semiconductor device package structure and method for fabricating the same

A method for fabricating a semiconductor device package structure, comprising:

• providing a substrate comprising a circuit structure formed in a die region, wherein the die region is defined by a plurality of scribe lines configured on the substrate;
• forming a seal ring in the substrate, the seal ring being located at a periphery region of the die region and surrounding at least a portion of the circuit structure;
• forming a trench ring in the substrate between the seal ring and the scribe lines;
• and
• forming a packaging passivation cap layer covering over the circuit structure and the seal ring and covering at least the trench ring.