High-throughput multi-stage manufacturing platform and method for processing a plurality of substrates

A manufacturing platform for fabrication of electronic devices on a plurality of substrates, the manufacturing platform comprising:

• a plurality of process modules hosted on the manufacturing platform, the plurality of process modules configured for manipulating materials on the plurality of substrates in processing steps as part of a processing sequence, the plurality of process modules including:
• a first process module configured for performing a blocking layer deposition process;
• a second process module configured for performing a film deposition process;
• a third process module configured for performing an etch process, wherein the blocking layer deposition process requires a longer processing time for each substrate than the film deposition process and the etch process, and wherein the first process module is configured for simultaneously processing a greater number of substrates than the second and third process modules;
• at least one substrate metrology module hosted on the manufacturing platform, the substrate metrology module including an inspection system operable for measuring data associated with an attribute of a substrate at least one of before or after the substrate is processed in a process module of the manufacturing platform;
• and
• at least one substrate transfer system hosted on the manufacturing platform and configured for the movement of the plurality of substrates between the plurality of process modules and the at least one metrology module.