Bevel edge removal methods, tools, and systems

A method comprising:

• locating a bevel brush around a wafer with a bevel region of the wafer interfacing a surface of the bevel brush;
• abrading the bevel region of the wafer using the surface of the bevel brush;
• distributing a solution to the bevel region of the wafer;
• and
• performing a chemical mechanical planarization on the wafer either immediately before or immediately after the abrading the bevel region and the distributing the solution.

A semiconductor device processing system comprising:

• an outer motor comprising a first rotatable surface;
• an inner motor nested within the outer motor, the inner motor comprising a second rotatable surface co-axially aligned with the first rotatable surface, the first rotatable surface being rotatable about the second rotatable surface;
• and
• a bevel brush secured to the first rotatable surface, wherein the bevel brush comprises a groove disposed between an inner surface and an outer surface of the bevel brush and wherein the bevel brush is radially adjustable.