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US 2021/0202220 A1Published application
Inspection method of plasma forming source and load
AssigneeTokyo Electron Limited
InventorShintaro Yawata
Life of this patent
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Abstract
There is provided an inspection method of a plasma forming source. The method includes providing a load configured to be capacitively and inductively coupled to the plasma forming source; and calculating a characteristic of the plasma forming source by receiving a signal from the plasma forming source while sending a reference signal to the plasma forming source.
Claims6
An inspection method of a plasma forming source, comprising:
- providing a load configured to be capacitively and inductively coupled to the plasma forming source;
- and
- calculating a characteristic of the plasma forming source by receiving a signal from the plasma forming source while sending a reference signal to the plasma forming source.
A load, comprising:
- a passive element configured to be capacitively and inductively coupled to a plasma forming source;
- a fixing member configured to fix the passive element to the plasma forming source;
- and
- a holding member configured to hold the passive element.
1 more element
Dependencies are inferred from the claim text.