Stage, substrate processing apparatus, and heat transfer gas supply method

A substrate processing apparatus having a stage on which a substrate is mounted in a chamber, wherein the stage comprises:

• a pin insertion passage penetrating the stage on which the substrate is mounted, and configured to allow a lifter pin to be inserted into and penetrate the pin insertion passage;
• a heat transfer gas passage penetrating the stage, and configured to introduce a heat transfer gas onto a mounting surface of the stage;
• a common gas passage in communication with the pin insertion passage and the heat transfer gas passage, and configured to allow the heat transfer gas to flow through the common gas passage;
• and
• a first member disposed to face the common gas passage at a location at which the pin insertion passage and the common gas passage intersect each other, and configured to adjust a flow rate of the heat transfer gas introduced onto the mounting surface of the stage from the pin insertion passage.