Resist composition, method of forming resist pattern, and acid diffusion-controlling agent
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsHiroto YAMAZAKI, Seiji TODOROKI, Masahiro SHIOSAKI, Nobuhiro MICHIBAYASHI
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Abstract
A resist composition is provided that generates an acid upon exposure and whose solubility in a developing solution is changed by action of an acid. The resist composition includes a base material component whose solubility in a developing solution is changed by action of an acid, and a compound represented by General Formula (d0) in which Rd01 represents a monovalent organic group, Rd02 represents a single bond or a divalent linking group, m represents an integer of 1 or greater, and Mm+ represents an m-valent organic cation
Claims7
A resist composition which generates an acid upon exposure and whose solubility in a developing solution is changed by action of an acid, the resist composition comprising:
- a base material component (A) whose solubility in a developing solution is changed by action of an acid;
- and
- a compound (D0) represented by General Formula (d0),
- wherein Rd01 represents a monovalent organic group;
- Rd02 represents a single bond or a divalent linking group;
- m represents an integer of 1 or greater;
- and Mm+ represents an m-valent organic cation.
An acid diffusion-controlling agent comprising a compound represented by General Formula (d0),
- wherein Rd01 represents a monovalent organic group;
- Rd02 represents a single bond or a divalent linking group;
- m represents an integer of 1 or greater;
- and Mm+ represents an m-valent organic cation.
Dependencies are inferred from the claim text.