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US 2021/0197506 A1Published application
Microlens device and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsMin JANG, Victor LENCHENKOV
Life of this patent
Estimating the term…
Abstract
Implementations of semiconductor devices may include: a microlens array formed of a plurality of microlenses. Each of the plurality of microlenses may have a first side and a second side. A layer of polymer may be formed over the second side of each of the plurality of microlenses and a low index box may be between adjacent microlenses of the plurality of microlenses.
Claims20
A semiconductor device comprising:
- a microlens array formed of a plurality of microlenses, each of the plurality of microlenses having a first side and a second side;
- a layer of polymer formed over the second side of each of the plurality of microlenses;
- and
- a low index box between adjacent microlenses of the plurality of microlenses.
1 more element
A semiconductor device comprising:
- a microlens array formed of a plurality of microlenses, each of the plurality of microlenses having a first side and a second side;
- a layer of polymer formed over the second side of each of the plurality of microlenses;
- and
- one or more air gaps in a portion of the layer of polymer between adjacent microlenses of the plurality of microlenses.
1 more element
A method of forming a semiconductor device, the method comprising:
- providing a semiconductor wafer, the semiconductor wafer comprising a first side and a second side;
- forming a planar layer on the second side of the semiconductor wafer;
- forming a photoresist layer on the planar layer;
- forming a microlens array in the planar layer;
- and
- coupling a polymer over and between each of a microlens of the microlens array.
3 more elements
Dependencies are inferred from the claim text.