Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies

A substrate of an electronic assembly comprising:

• a material in a deposition pattern within a pad area of the substrate, the deposition pattern comprising an array of discrete domains of the material that extends across the pad area of the substrate with regular spacings of about 0.076 to about 0.203 millimeters (mm) between the discrete domains, the deposition pattern comprising the array of discrete domains has a tangency with respect to an edge of the pad area of about 0.025 mm to about 0.127 mm.