Method for coupling a wire to conductive fabric with low-temperature solder

Abstract

Various implementations include a method of coupling a wire to conductive fabric. The method includes providing a conductive fabric, placing low-temperature solder in contact with a portion of the conductive fabric wherein the low-temperature solder has a liquidus temperature and a solidus temperature, placing a wire in contact with the low-temperature solder, increasing the temperature of the low-temperature solder to the liquidus temperature, and decreasing the temperature of the low-temperature solder to the solidus temperature. In some implementations, the low-temperature solder has a preformed shape corresponding to a surface of a portion of a wire, and the surface of the wire is placed in contact with the low-temperature solder.

Dependencies are inferred from the claim text.