Glass substrate having through hole and hollowed-out portion and method for producing the same
AssigneeAGC Inc.
InventorsMamoru ISOBE, Kohei HORIUCHI
Life of this patent
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Abstract
A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.
Claims13
A glass substrate for a semiconductor package, comprising:
- a first principal surface;
- a second principal surface;
- at least one hollowed-out portion;
- and
- at least one through hole formed in a surrounding of the at least one hollowed-out portion,
- wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.
A production method for producing a glass substrate for a semiconductor package, comprising:
- preparing the glass substrate including a first principal surface and a second principal surface;
- emitting a laser to, on the first principal surface of the glass substrate, a through hole formation prospective position and a contour of a hollowed-out portion prospective shape;
- and
- forming a through hole and a hollowed-out portion by etching the glass substrate.
Dependencies are inferred from the claim text.