Laser welding coated substrates
AssigneeCorning Incorporated
InventorsStephan Lvovich Logunov, Mark Alejandro Quesada, Alexander Mikhailovich Streltsov
Life of this patent
Estimating the term…
Loading patent…
AssigneeCorning Incorporated
InventorsStephan Lvovich Logunov, Mark Alejandro Quesada, Alexander Mikhailovich Streltsov
Estimating the term…
Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.
A method of laser bonding a multi-layer film to a substrate, the method comprising:
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
A bonded structure comprising:
(canceled)
(canceled)
(canceled)
Dependencies are inferred from the claim text.