Electromagnetic Interference (EMI) shielding film, circuit board, and preparation method for EMI shielding film

Abstract

Provided are an Electromagnetic Interference (EMI) shielding film, a circuit board including the EMI shielding film, and a preparation method for the EMI shielding film. The EMI shielding film includes a shielding layer and an adhesive film layer, wherein the shielding layer includes a first surface and a second surface opposite to each other; the second surface is a rolling uneven surface; convex conductor particles are also formed on the rolling uneven surface; and the second surface of the shielding layer is provided with the adhesive film layer, so the adhesive film layer of the EMI shielding film will extrude adhesive materials into recesses of the second surface in a lamination process, the adhesive holding capacity is increased, and delamination and blister of board is unlikely to occur. Moreover, the rolling uneven surface also has conductor particles with a certain height, so it can be ensured that the shielding layer smoothly punctures the adhesive film layer in the lamination process, reliable grounding is achieved, and the practicality is strong.

Dependencies are inferred from the claim text.