Liquid-cooling heat dissipation device
AssigneeCooler Master Co., Ltd.
InventorTung-Yang SHIEH
Life of this patent
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Abstract
The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.
Claims13
A liquid-cooling heat dissipation device, configured to be in thermal contact with an expansion card, comprising:
- a base plate, configured to be mounted on the expansion card;
- a thermally-conductive component, mounted on the base plate, wherein
- the thermally-conductive component and the base plate together form a liquid chamber therebetween;
- and
- a heat exchanger, mounted on the base plate and connected to the liquid chamber.
Dependencies are inferred from the claim text.