Reflow oven

Abstract

The present disclosure discloses a reflow oven for processing a circuit board, the reflow oven comprising a heating zone, a plurality of heating devices and a start-stop device. The heating zone comprises a plurality of heating sub-zones, the plurality of heating devices are arranged in corresponding heating sub-zones of the plurality of heating sub-zones, and each of the plurality of heating devices is configured such that a working temperature of the corresponding heating sub-zone is in a predetermined temperature interval. The start-stop device is configured to activate or deactivate the plurality of heating devices, and the start-stop device is configured in such a way that the start-stop device activates or deactivates the plurality of heating devices according to predetermined time intervals in a process during which the circuit board sequentially passes through the plurality of heating sub-zones, such that a working temperature of each of the plurality of heating sub-zones is in a corresponding predetermined temperature interval. The reflow oven according to the present disclosure can perform soldering and processing of large-sized circuit boards and prevent the occurrence of overheating in a hearth of the reflow oven.

Dependencies are inferred from the claim text.