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US 2021/0176865 A1Published application
Method for repairing a fine line
AssigneeGuangdong University of Technology
InventorsChengqiang CUI, Guannan YANG, Guangdong XU, Yu ZHANG, Xin CHEN
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Abstract
A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.
Claims11
A method for repairing a fine line, comprising:
- 1) filling nano metal particles in a defect of a circuit board;
- 2) irradiating, by a laser, or heating, the nano metal particles in the defect, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board;
- and
- 3) cleaning a surface of the circuit board to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board;
- wherein in step 1), after the nano metal particles are filled in the defect, a light-transmitting plate covers the defect, and a downward force is applied to the light-transmitting plate;
- and
- in step 2), during the irradiation by the laser, the laser is focused on the nano metal particles under the light-transmitting plate.
4 more elements
Dependencies are inferred from the claim text.