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US 2021/0175873 A1Published application
Multi-filter die
AssigneeIntel Corporation
InventorsGeorgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
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Abstract
Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.
Claims20
An acoustic wave resonator (AWR) die comprising:
- a die body;
- a first filter in the die body, wherein the first filter has a first bandwidth;
- and
- a second filter in the die body, wherein the second filter has a second bandwidth;
- and
- wherein the first bandwidth is different than the second bandwidth.
3 more elements
An acoustic wave resonator (AWR) die that includes:
- a die body;
- a first filter in the die body, wherein the first filter is related to a first frequency bandwidth;
- a second filter in the die body, wherein the second filter is related to a second frequency bandwidth that is different than the first frequency bandwidth;
- a first electromagnetic interference (EMI) structure that surrounds the first filter;
- and
- a second EMI structure that surrounds the second filter.
3 more elements
A microelectronic package comprising:
- a package substrate with a first side and a second side opposite the first side;
- an acoustic wave resonator (AWR) die coupled with the first side of the package substrate, wherein the AWR die includes a first filter and a second filter;
- and
- an active die coupled with the second side of the package substrate.
1 more element
Dependencies are inferred from the claim text.