Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

An optoelectronic semiconductor device with a mounting surface and a radiation exit face opposite the mounting surface, wherein

• the semiconductor device comprises a semiconductor chip provided for generating radiation;
• the semiconductor device comprises a package body which surrounds the semiconductor chip in a lateral direction;
• the semiconductor chip is free of package body material at the radiation exit face;
• a side face of the semiconductor chip is adjoined by a fillet, the fillet extending at least in regions between the side face of the semiconductor chip and the package body;
• the optoelectronic semiconductor device comprises a first contact and a second contact on the mounting surface, wherein at least one of the first contact and the second contact is electrically conductively connected to the semiconductor chip by way of a through-via;
• the fillet extends over an entire circumference of the semiconductor chip;
• the fillet tapers in the direction of the mounting surface when viewed from the radiation exit face;
• and
• the package body at least in regions does not extend between the semiconductor chip and the mounting surface when seen along a vertical direction running perpendicular to the mounting surface.