Semicondutor package structures and methods of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorJr-Wei LIN
Life of this patent
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Abstract
A semiconductor package structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a substrate and a circuit. The substrate has a first portion and a second portion. A first thickness of the first portion is greater than a second thickness of the second portion. The circuit is disposed on the second portion of the substrate. The second semiconductor device is disposed on the circuit of the first semiconductor device.
Claims20
A semiconductor package structure, comprising:
- a first semiconductor device, comprising:
- a substrate comprising a first portion and a second portion, wherein a first thickness of the first portion is greater than a second thickness of the second portion;
- and
- a circuit disposed on the second portion of the substrate;
- and
- a second semiconductor device disposed on the circuit of the first semiconductor device.
A semiconductor package structure, comprising:
- a first semiconductor device having a substrate, the substrate having a first surface at a first elevation and a second surface at a second elevation less than the first elevation;
- and
- a second semiconductor device disposed on the second surface of the substrate of the first semiconductor device.
A method for manufacturing a semiconductor package structure, comprising:
- removing a part of a substrate to form a first portion and a second portion, wherein a first thickness of the first portion is greater than a second thickness of the second portion;
- forming a circuit on the second portion of the substrate;
- and
- disposing a semiconductor device on the circuit.
Dependencies are inferred from the claim text.