US 2021/0175375 A1 · METAL-FOIL-ASSISTED FABRICATION OF THIN-SILICON SOLAR CELL

Abstract

One embodiment relates to a method of fabricating a solar cell. A silicon lamina is cleaved from the silicon substrate. The backside of the silicon lamina includes the P-type and N-type doped regions. A metal foil is attached to the backside of the silicon lamina. The metal foil may be used advantageously as a built-in carrier for handling the silicon lamina during processing of a frontside of the silicon lamina. Another embodiment relates to a solar cell that includes a silicon lamina having P-type and N-type doped regions on the backside. A metal foil is adhered to the backside of the lamina, and there are contacts formed between the metal foil and the doped regions. Other embodiments, aspects and features are also disclosed.

Claims20

Dependent claims

A solar cell comprising:

a primary substrate having a front side that faces the sun during normal operation and a backside opposite the front side;
a P-type emitter and an N-type emitter on the backside of the primary substrate;
a dielectric layer on the P-type and N-type emitters;
a metal foil on the first dielectric layer, the metal foil comprising a first contact finger that extends through the dielectric layer to electrically connect to the P-type emitter and a second contact finger that extends through the dielectric layer to electrically connect to the N-type emitter;
and
a secondary substrate on the metal foil,
wherein the metal foil includes a finger separation area between the dielectric layer and the secondary substrate.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/176,489Filed 16 Feb 2021

Priority

21 Dec 2012

Published

10 Jun 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10F 77/30
Constructional details of devices covered by this subclass: coatings
H10F 10/146
Photovoltaic cells having only PN homojunction potential barriers: back-junction photovoltaic cells, e.g. having interdigitated base-emitter…
H10F 71/1395
Using temporary substrates: for thin-film devices
H10F 77/211
For devices having potential barriers: for photovoltaic cells

Family

Application13/725,580Continuation · filed 21 Dec 2012

Application15/722,480Continuation · filed 2 Oct 2017

Application17/176,489Continuation

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US 9,812,592 B2Related patent

US 2021/0175375 A1This patent

From the US filing history. Foreign family members aren’t listed.

Metal-foil-assisted fabrication of thin-silicon solar cell

Life of this patent

Metal-foil-assisted fabrication of thin-silicon solar cell

Life of this patent

Abstract

Claims20