Integrated Circuit Package for Isolation Dies

A system comprising:

• a substrate that includes a first voltage domain and a second voltage domain;
• first circuitry mounted on the substrate in the first voltage domain, the first circuitry having a first signal terminal;
• second circuitry mounted on the substrate in the second voltage domain, the second circuitry having a second signal terminal;
• and
• an isolation device having an input terminal coupled to the first terminal and an output terminal coupled to the second terminal, wherein the isolation device comprises:
• an isolation die having bond pads;
• a first lead frame having first leads, the isolation die being mounted on the first lead frame with a portion of the bond pads coupled to respective first leads;
• first mold material encapsulating the isolation die and the first lead frame forming a first package;
• a second lead frame having second leads, the first package being mounted on the second lead frame with a portion of the first leads coupled to respective second leads;
• and
• second mold material encapsulating the first package and the second lead frame.

A method for fabricating an isolation device, the method comprising:

• fabrication an isolation die having bond pads;
• mounting the isolation die on a first lead frame having first leads;
• coupling a portion of the bond pads to respective first leads;
• encapsulating the isolation die and the first lead frame with a first mold material to form a first package;
• mounting the first package on a second lead frame having second leads;
• coupling a portion of the first leads to respective second leads;
• and
• encapsulating the first package and the second lead frame with a second mold material.