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US 2021/0175221 A1Published application
Photorelay
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorTatsuo Tonedachi
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Abstract
A photorelay of an embodiment includes a polyimide substrate having a first surface and a second surface on an opposite side of the polyimide substrate from the first surface, the polyimide substrate having a thickness equal to or more than 10 μm and equal to or less than 120 μm, an input terminal provided on the second surface, an output terminal provided on the second surface, a light receiving element provided on the first surface, a light emitting element provided on the light receiving element, and a MOSFET provided on the first surface.
Claims6
A photorelay comprising:
- a polyimide substrate having a first surface and a second surface on an opposite side of the polyimide substrate from the first surface, the polyimide substrate having a thickness equal to or more than 10 μm and equal to or less than 120 μm;
- an input terminal provided on the second surface;
- an output terminal provided on the second surface;
- a light receiving element provided on the first surface;
- a light emitting element provided on the light receiving element;
- and
- a MOSFET provided on the first surface.
4 more elements
Dependencies are inferred from the claim text.