Mounting apparatus

A mounting apparatus which mounts a semiconductor chip to a mounted body which is a substrate or another semiconductor chip via an adhesive material, comprising:

• a bonding stage on which the substrate is placed;
• a base supporting the bonding stage;
• a mounting head for performing a temporary press-attachment process in which the semiconductor chip is suction-held and temporarily press-attached to the mounted body and a final press-attachment process in which the temporarily press-attached semiconductor chip is finally press-attached;
• a film arrangement mechanism which is arranged on the bonding stage or the base and interposes a cover film between the temporarily press-attached semiconductor chip and the mounting head at the time of the final press-attachment process;
• and
• a controller which controls a driving of the mounting head and the film arrangement mechanism, wherein
• the film arrangement mechanism comprises:
• a film feed-out mechanism which has a pair of rollers with the cover film extended there-between and successively feeds out a new cover film;
• and
• a film movement mechanism moving the cover film in a horizontal direction with respect to the substrate.