Integrated device with electromagnetic shield

An integrated device comprising:

• a first device layer comprising an active device and a first device bonding layer;
• a second device layer comprising a passive device and a second device bonding layer, the second device layer attached to the first device bonding layer;
• and
• means for shielding electromagnetic (EM) waves, the means for shielding EM waves surrounding the active device comprising a plurality of bonding contacts in a first plane of the first device bonding layer, a plurality of bonding layer contact in a second plane parallel to the first plane, a plurality of bonding layer interconnects in the second plane, a plurality of vias in a third plane parallel to the second plane opposite the first plane, and a plurality of end of line interconnects in a fourth plane parallel to the third plane opposite the second plane, wherein the plurality of bonding layer interconnects couple at least one of the plurality of bonding layer interconnects to at least another one of the plurality of bonding layer interconnects and the plurality of end of line interconnects couple at least one of the plurality of vias to at least another one of the plurality of vias.

A method for manufacturing an integrated device, the method comprising:

• forming a first device substrate;
• forming an active device in the first device substrate;
• forming a shield around the active device;
• forming a first device bonding layer on a first side of the first device substrate;
• forming a second device substrate;
• forming a passive device in the second device substrate;
• forming a second device bonding layer on a first side of the second device substrate;
• and
• bonding the first device bonding layer to the second device bonding layer.