Package comprising a double-sided redistribution portion

An apparatus comprising:

• a first integrated device;
• first means for encapsulation configured for encapsulating the first integrated device;
• a redistribution portion comprising a plurality of redistribution interconnects,
• wherein the redistribution portion comprises a first surface and a second surface, and
• wherein the first integrated device and the first means for encapsulation are coupled to the first surface of the redistribution portion;
• a second integrated device coupled to the second surface of the redistribution portion;
• and
• second means for encapsulation coupled to the second surface of the redistribution portion, the second means for encapsulation configured for encapsulating the second integrated device.

A method for fabricating a package, comprising:

• providing a first integrated device;
• forming a first encapsulation layer over the first integrated device;
• forming a redistribution portion over the first integrated device and the first encapsulation layer, wherein forming the redistribution portion comprises forming a plurality of redistribution interconnects;
• coupling a second integrated device to a second surface of the redistribution portion;
• and
• forming a second encapsulation layer over the second surface of the redistribution portion such that the second encapsulation layer encapsulates the second integrated device.