Secure semiconductor integration

A system comprising:

• a plurality of components, wherein
• said plurality of components including a first component and a second component, and
• said first component is a security component configured to generate and/or store security key(s);
• a first substrate;
• a second substrate;
• one or more standoff substrate(s) comprising of cavity(ies), wherein
• said one or more standoff substrate(s) is/are coupled to said first substrate and said second substrate,
• said one or more standoff substrate(s) completely encircles said first substrate and/or said second substrate,
• said security component is disposed inside said cavity(ies),
• said security component is coupled to said first substrate and/or said second substrate,
• said security component is obfuscated by said first substrate and/or said second substrate and/or said one or more standoff substrate(s) to minimize tampering,
• said second component is coupled to said first substrate and/or said second substrate,
• said second component is configured to communicate with said security component, and
• said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification.

A system comprising:

• a plurality of components, wherein
• said plurality of components including a first component and a second component, and
• said first component is a security component configured to generate and/or store security key(s);
• a first substrate;
• a second substrate, wherein
• said second substrate comprising cavity(ies);
• and
• one or more standoff substrate(s), wherein
• said one or more standoff substrate comprising said cavity(ies),
• said security component is disposed inside said second substrate cavity(ies),
• said second substrate is coupled to said first substrate,
• said one or more standoff substrate(s) is/are coupled to said first substrate and/or said second substrate,
• said one or more standoff substrate(s) completely encircles said first substrate and/or said second substrate,
• said security component is obfuscated by said first substrate and/or said second substrate and/or said one or more standoff substrate(s) to minimize tampering,
• said second component is coupled to said first substrate or said second substrate,
• said second component is configured to communicate with said security component, and
• said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification.