Package comprising a substrate having a via wall configured as a shield

An apparatus comprising:

• a substrate comprising a routing region and a non-routing region along a periphery of the substrate, wherein the non-routing region comprises means for via shielding;
• an integrated device coupled to the substrate;
• and
• means for encapsulation located over the substrate such that the means for encapsulation encapsulates the integrated device.

A method for fabricating a package, comprising:

• providing a substrate comprising a routing region and a non-routing region along a periphery of the substrate, wherein the non-routing region comprises a plurality of vias configured as a shield;
• coupling an integrated device to the substrate;
• and
• forming an encapsulation layer over the substrate such that the encapsulation layer encapsulates the integrated device.