Fluid Channel, Power Semiconductor Module and Method for Fabricating a Power Semiconductor Module

A fluid channel for a power semiconductor module, the fluid channel comprising:

• a die carrier configured to carry a plurality of semiconductor dies on a first side;
• a plurality of cooling elements arranged on a second side of the die carrier opposite the first side;
• and
• a channel wall arranged opposite the second side of the die carrier and forming a cavity,
• wherein the cooling elements are arranged in the cavity,
• wherein the cooling elements are arranged more densely in a center region of the cavity than in a fringe region of the cavity,
• wherein a height profile of the cavity is configured such that a flow velocity along the fluid channel is greater in the fringe region than in the center region.

A power semiconductor module, comprising:

• a die carrier;
• a plurality of semiconductor dies arranged on a first side of the die carrier;
• and
• a plurality of cooling elements arranged on a second side of the die carrier opposite the first side,
• wherein the cooling elements are attached to the die carrier at attachment points,
• wherein a majority of the attachment points are positioned vertically in alignment with positions of the semiconductor dies.

A power semiconductor module, comprising:

• a die carrier;
• a plurality of semiconductor dies arranged on a first side of the die carrier;
• and
• a plurality of cooling elements arranged on a second side of the die carrier opposite the first side,
• wherein the cooling elements are arranged in rows that are in alignment with positions of the semiconductor dies,
• wherein there is a gap between consecutive positions of the semiconductor dies and also a corresponding gap between respective consecutive rows of the cooling elements.

A method for fabricating a fluid channel for a power semiconductor module, the method comprising:

• providing a die carrier configured to carry a plurality of semiconductor dies on a first side;
• arranging a plurality of cooling elements on a second side of the die carrier opposite the first side;
• and
• arranging a channel wall opposite the second side of the die carrier and thereby forming a cavity,
• wherein the cooling elements are arranged in the cavity,
• wherein the cooling elements are attached to the die carrier at attachment points,
• wherein a majority of the attachment points is positioned vertically in alignment with positions of the semiconductor dies.