Thermally conductive electronic packaging

An apparatus, comprising:

• a circuit board comprising a metallic base plate, a thermally conductive dielectric, and a plurality of metallic pads;
• at least three die, wherein each die of the at least three die are coupled to a respective metallic pad of the plurality of metallic pads;
• wherein, based on each of the at least three die being coupled to a respective metallic pad of the plurality of metallic pads, a first die of the at least three die is configured to exhibit a first bottom-side electrical potential, a second die of the at least three die is configured to exhibit a second bottom-side electrical potential, and a third die of the at least three die is configured to exhibit a third bottom-side electrical potential, wherein the second die serves as a driver circuit for positive output signals of the first die and the third die serves as a driver circuit for negative output signals of the first die;
• and
• wherein the apparatus is configured to conduct heat away from the at least three die via the thermally conductive dielectric.

An apparatus, comprising:

• a circuit board comprising a metallic base plate, a thermally conductive dielectric, and a plurality of metallic pads;
• a non-conductive housing configured to at least partially enclose the circuit board;
• a plurality of leads coupled to the plurality of metallic pads, wherein the non-conductive housing is further configured with a void between the plurality of leads and the metallic base plate;
• at least three die, wherein each die of the at least three die are coupled to a respective metallic pad of the plurality of metallic pads;
• wherein, based on each of the at least three die being coupled to a respective metallic pad of the plurality of metallic pads, a first die of the at least three die is configured to exhibit a first bottom-side electrical potential, a second die of the at least three die is configured to exhibit a second bottom-side electrical potential, and a third die of the at least three die is configured to exhibit a third bottom-side electrical potential, wherein the first bottom-side electrical potential, the second bottom-side electrical potential, and the third bottom-side electrical potential are each electrically isolated from each other;
• and
• wherein the apparatus is configured to conduct heat away from the at least three die via the thermally conductive dielectric.