Electronic control device
AssigneeHitachi Automotive Systems, Ltd.
InventorsMinami TERANISHI, Shinya KAWAKITA, Hideyuki SAKAMOTO
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Abstract
An electronic control device includes a substrate, a heat generating component mounted on the substrate, a heat dissipation unit thermally coupled to a surface of the heat generating component located on a side opposite to the substrate side, and a cooling mechanism thermally coupled to the heat dissipation unit. The heat dissipation unit includes a porous thermal conductor and a semi-cured resin which includes a heat conductive filler and is formed between at least the porous thermal conductor and the surface of the heat generating component.
Claims11
An electronic control device comprising:
- a substrate;
- a heat generating component mounted on the substrate;
- a heat dissipation unit thermally coupled to a surface of the heat generating component located on a side opposite to the substrate side;
- and
- a cooling mechanism thermally coupled to the heat dissipation unit, wherein
- the heat dissipation unit includes:
- a porous thermal conductor;
- and
- a semi-cured resin which includes a heat conductive filler and is formed between at least the porous thermal conductor and the surface of the heat generating component.
Dependencies are inferred from the claim text.