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US 2021/0175142 A1Published application
Integrated circuit (ic) tag
AssigneeFujitsu Limited
InventorsShinichi Tajima, Yasushi Masuda, Tetsuro Yamada, Atsushi Yamaguchi
Life of this patent
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Abstract
An integrated circuit (IC) tag includes: an IC chip; a substrate that is provided with an antenna on a first surface; an adhesive portion configured to adhere a side surface of the IC chip and a peripheral of the IC chip in a state that a terminal of the IC chip is electrically coupled to the antenna; and a first member that is provided between the antenna and the adhesive portion, the first member having an elastic modulus higher than an elastic modulus of the antenna.
Claims9
An integrated circuit (IC) tag comprising:
- an IC chip;
- a substrate that is provided with an antenna on a first surface;
- an adhesive portion configured to adhere a side surface of the IC chip and a peripheral of the IC chip in a state that a terminal of the IC chip is electrically coupled to the antenna;
- and
- a first member that is provided between the antenna and the adhesive portion, the first member having an elastic modulus higher than an elastic modulus of the antenna.
2 more elements
Dependencies are inferred from the claim text.