Semiconductor device and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising:

• molding a powder-like second insulating resin into a sheet-like second insulating resin by using a resin molder;
• transferring the sheet-like second insulating resin to a position above a lower die while being disposed on the resin molder, and placing the sheet-like second insulating resin on the lower die;
• disposing a lead frame on which a semiconductor element is mounted, on the sheet-like second insulating resin disposed on the lower die;
• and
• mounting an upper die to the lower die, and performing transfer molding to form a first insulating resin member sealing a mounting surface, of the lead frame, on which the semiconductor element is mounted, and a second insulating resin member sealing a heat dissipating surface, of the lead frame, opposite to the mounting surface.

A method for manufacturing a semiconductor device, comprising:

• molding a powder-like second insulating resin into a sheet-like second insulating resin on a heat sink by using a resin molder;
• transferring the sheet-like second insulating resin molded on the heat sink to a position above a lower die while being disposed on the resin molder together with the heat sink, and placing the sheet-like second insulating resin and the heat sink on the lower die;
• disposing a lead frame on which a semiconductor element is mounted, on the sheet-like second insulating resin and the heat sink disposed on the lower die;
• and
• mounting an upper die to the lower die, and performing transfer molding, thereby forming a first insulating resin member sealing a mounting surface, of the lead frame, on which the semiconductor element is mounted, and a second insulating resin member sealing a heat dissipating surface, of the lead frame, opposite to the mounting surface, and joining the heat sink to the second insulating resin member.