Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection
AssigneeCree, Inc.
InventorKyoung-Keun Lee
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Abstract
A process of forming a device with a pad structure having environmental protection includes providing a semiconductor body portion, arranging a pad on the semiconductor body portion, providing at least one environment encapsulation portion at least partially on the pad, arranging a supplemental pad on the pad, and arranging the supplemental pad to include side surfaces that extend vertically above the at least one environment encapsulation portion. A device having a pad structure having environmental protection is also disclosed.
Claims20
A device configured with a pad structure having environmental protection, the device comprising:
- a semiconductor body portion;
- a pad;
- at least one environment encapsulation portion;
- a supplemental pad;
- the pad being arranged on the semiconductor body portion;
- and
- the supplemental pad being arranged on the pad,
- wherein the supplemental pad includes side surfaces that extend vertically above the at least one environment encapsulation portion;
- and
- wherein the supplemental pad comprises a top surface configured to bond to a bonding wire.
A process of forming a device with a pad structure having environmental protection, the process comprising:
- providing a semiconductor body portion;
- arranging a pad on the semiconductor body portion;
- providing at least one environment encapsulation portion at least partially on the pad;
- arranging a supplemental pad on the pad;
- and
- arranging the supplemental pad to include side surfaces that extend vertically above the at least one environment encapsulation portion,
- wherein the supplemental pad comprises a top surface configured to bond to a bonding wire.
Dependencies are inferred from the claim text.