Method of dismantling a stack of at least three substrates

A Method for disassembling a stack of at least first, second and third substrates having two interfaces therebetween, among which a first interface between the first substrate and the second substrate of the stack has a first adhesion energy and a second interface between the second substrate and the third substrate in the stack has a second adhesion energy, the first adhesion energy being lower, than the second adhesion energy, the stack comprising a front face and a rear face between which the first substrate, the second substrate and then the third substrate extend successively, the method comprising successively:

• through the front face of the stack, removing a material on the first substrate, until a surface of the second substrate is exposed,
• transferring the stack, by means of the front face thereof, onto an adhesive layer of a flexible adhesive film until the surface is in contact with the adhesive layer and has therewith an adhesion energy that is higher than the second adhesion energy, and
• disassembling the third substrate from the flexible adhesive film and from an assembly comprising the first and second substrates, at the second interface.

A microelectronic device, comprising:

• a stack of at least first, second and third substrates having two interfaces therebetween, among which a first interface between the first substrate and the second substrate of the stack has a first adhesion energy and a second interface between the second substrate and the third substrate in the stack has a second adhesion energy, the first adhesion energy being lower than the second adhesion energy, the stack comprising a front face and a rear face between which the first substrate, the second substrate and then the third substrate extend successively, the second substrate having an exposed surface, and
• a flexible adhesive film comprising an adhesive layer onto which the stack is transferred by means of the front face thereof, the exposed surface being in contact with the adhesive layer and having therewith an adhesion energy higher than the second adhesion energy.