Apparatus for manufacturing semiconductor device and manufacturing method of semiconductor device

A method of manufacturing a semiconductor device, comprising:

• supplying a first bias power supply to a first bias electrode connected to a lower portion of an electrostatic chuck in which a semiconductor wafer is seated;
• supplying a second bias power supply to a second bias electrode above the electrostatic chuck;
• and
• supply a ring voltage, having a non-sinusoidal periodic waveform, to a ring electrode inside an edge ring surrounding the electrostatic chuck,
• wherein the ring voltage has a positive voltage during a first time period of a period of the non-sinusoidal periodic waveform, and has a negative voltage during a second time period, different from the first time period, of the period of the non-sinusoidal periodic waveform, and
• wherein the negative voltage has a magnitude that increases during the second time period.