In situ failure detection in semiconductor processing chambers
AssigneeApplied Materials, Inc.
InventorsSrivatsa Madananth, Dhananjai Kumar, Yogananda Sarode Vishwanath, Jacob Andrews
Life of this patent
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Abstract
Exemplary semiconductor processing chambers may include a chamber body defining a substrate processing region. The chambers may include a substrate support positioned within the substrate processing region. The substrate support may include a ceramic or polymeric insulator plate positioned between a cathode assembly and an electrostatic chuck assembly. The chambers may include an acoustic emission probe in contact with the insulator plate of the substrate support.
Claims20
A semiconductor processing chamber comprising:
- a chamber body defining a substrate processing region;
- a substrate support positioned within the substrate processing region, wherein the substrate support comprises a ceramic or polymeric insulator plate positioned between a cathode assembly and an electrostatic chuck assembly;
- and
- an acoustic emission probe in contact with the insulator plate of the substrate support.
A semiconductor processing chamber comprising:
- a chamber body defining a substrate processing region;
- a substrate support positioned within the substrate processing region, wherein the substrate support comprises:
- an electrostatic chuck configured to support a semiconductor substrate,
- a cooling plate coupled with the electrostatic chuck and configured to receive a temperature controlled fluid at a first temperature,
- a facility plate operable at a second temperature greater than the first, and
- a gap formed between the cooling plate and the facility plate within the substrate support;
- and
- an acoustic emission probe extending through the facility plate and the cooling plate, wherein the acoustic emission probe is in contact with the electrostatic chuck.
A method of semiconductor processing, the method comprising:
- performing a process on a semiconductor substrate, the semiconductor substrate seated on a substrate support within a processing region of a semiconductor processing chamber;
- detecting acoustic emissions from an acoustic emission probe positioned against an insulator plate or an electrostatic chuck of the substrate support;
- identifying an acoustic emission above a threshold emission level while performing the process;
- and
- adjusting the process to reduce stress within the insulator plate or the semiconductor substrate.
Dependencies are inferred from the claim text.