Ceramic electronic component and production method therefor

A ceramic electronic component comprising:

• external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body, wherein
• when an opposing direction of two faces opposed to each other in the ceramic component body is defined as a first direction, an opposing direction of other two faces opposed to each other is defined as a second direction, an opposing direction of the remaining other two faces opposed to each other is defined as a third direction, and dimensions along respective directions are defined as a first direction dimension, a second direction dimension, and a third direction dimension respectively,
• each of the external electrodes includes
• <1> an underlying metal layer having an end face portion covering each end face in the first direction of the ceramic component body and a wraparound portion covering respective parts of the remaining four faces around the each end face that are continuously formed;
• <2> an intermediate metal layer having an end face portion covering each end face portion of the underlying metal layer and a wraparound portion covering each wraparound portion of the underlying metal layer that are continuously formed;
• <3> a conductive resin layer having an end face portion covering each end face portion of the intermediate metal layer and a wraparound portion covering each wraparound portion of the intermediate metal layer that are continuously formed;
• <4> an external metal layer having an end face portion covering each end face portion of the conductive resin layer and a wraparound portion covering each wraparound portion of the conductive resin layer that are continuously formed, and
• on at least a mounting side part of the wraparound portion of the underlying metal layer and on at least a mounting side part of the wraparound portion of the intermediate metal layer, a tip portion of the wraparound portion of the underlying metal layer is covered by a tip portion of the wraparound portion of the intermediate metal layer and a tip angle α between an outer face of the tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is smaller than a tip angle β between an outer face of the tip portion of the wraparound portion of the intermediate metal layer and the surface of the ceramic component body.