Device and method for monitoring power semiconductor die
AssigneeMitsubishi Electric Corporation
InventorsNicolas DEGRENNE, Stefan MOLLOV, Jeffrey EWANCHUK
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Abstract
A device comprising at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends. The first end is able to be connected at least to a light source and to a light receiver. The second end is permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.
Claims21
-13. (canceled)
A device for monitoring a power semiconductor die coated with a metallization, comprising at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends, a first end being able to be connected at least to a light source and to a light receiver, the second end being permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.
A method to monitor a power semiconductor die coated with a metallization comprising:
- fixing permanently a light guide facing to a surface of the metallization,
- collecting through said light guide a light beam reflected on said surface,
- converting the collected light beam into an electric signal,
- comparing said signal to at least one reference,
- generating a monitoring signal in function of the result of the comparison.
Dependencies are inferred from the claim text.