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US 2021/0172884 A1Published application
Inspection device and inspection method
AssigneeJuki Corporation
InventorYasuyuki NURIYA
Life of this patent
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Abstract
An inspection device includes an image acquisition unit configured to acquire images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate, and an image processing unit configured to specify a shape of the solder based on a difference in brightness between the images acquired by the image acquisition unit, and generate, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.
Claims17
An inspection device, comprising:
- an image acquisition unit configured to acquire images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate;
- and
- an image processing unit configured to specify a shape of the solder based on a difference in brightness between the images acquired by the image acquisition unit, and generate, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.
An inspection method, comprising:
- acquiring images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate;
- and
- specifying a shape of the solder based on a difference in brightness between the acquired images, and generating, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.
Dependencies are inferred from the claim text.