Nano-twinned copper layer, method for manufacturing the same, and substrate comprising the same

A method for manufacturing a nano-twinned copper layer, comprising the following steps:

• providing an electrodepositing system, which comprises an anode, a cathode, a plating solution and a power supply, wherein the power supply is electrically connected to the anode and the cathode, and the anode and the cathode are immersed in the plating solution;
• performing electrodeposition at a first current density, which is 0.8 to 1.0 times of a limiting current density of the electrodepositing system;
• and
• performing electrodeposition at a second current density, which is 0.1 to 0.6 times of the limiting current density of the electrodepositing system, to grow a nano-twinned copper layer on a surface of the cathode,
• wherein over 50% of a volume of the nano-twinned copper layer comprises a plurality of columnar crystal grains, the plurality of columnar crystal grains connect to each other, at least 70% of the plurality of columnar crystal grains are formed by a plurality of nano-twins stacking in an orientation of a [111] crystal axis, and an angle included between two adjacent columnar crystal grains is greater 20° and less than or equal to 60°.

A substrate with a nano-twinned copper layer, comprising:

• a substrate;
• and
• a nano-twinned copper layer disposed on a surface of the substrate or embedded in the substrate,
• wherein over 50% of a volume of the nano-twinned copper layer comprises a plurality of columnar crystal grains, the plurality of columnar crystal grains connect to each other, at least 70% of the plurality of columnar crystal grains are formed by a plurality of nano-twins stacking in an orientation of a [111] crystal axis, and an angle included between two adjacent columnar crystal grains is greater 20° and less than or equal to 60°.