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US 2021/0172084 A1Published application
Method for reproducing plating solution
AssigneeC. Uyemura & Co., Ltd.
InventorsDaisuke HASHIMOTO, Masayuki KISO, Akira OKADA, Hironori SUGIURA, Toshikazu KANO, Keita TANIGUCHI
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Abstract
A plating solution containing a leveler is brought into contact with silica particles with an average particle diameter of 500 μm or less to remove impurities from the plating solution.
Claims7
A method for reproducing a plating solution comprising:
- bringing a plating solution containing a leveler into contact with silica particles with an average particle diameter of 500 μm or less to remove impurities from the plating solution.
Dependencies are inferred from the claim text.