Trivalent chromium plating solution and method for chromium-plating using same

Abstract

A trivalent chromium plating solution having a high plating deposition rate and being practical is provided with a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, potassium sulfate and ammonium sulfate as a conductive salt, a pH buffer, and a sulfur-containing organic compound, containing a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof as the complexing agent, and containing a combination of saccharin or a salt thereof and a sulfur-containing organic compound having an allyl group as the sulfur-containing organic compound.

Dependencies are inferred from the claim text.