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US 2021/0171802 A1Published application
Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same
AssigneeLG Chem, Ltd.
InventorsSera KIM, Ji Ho HAN, Kwang Joo LEE
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Abstract
An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.
Claims14
An adhesive sheet for temporary fixation, the adhesive sheet comprising:
- a polymer base film having a glass transition temperature (Tg) of at least 60° C.;
- and at least one adhesive layer including a binder resin having a photoreactive functional group, a photoinitiator having activity at a wavelength of 300 nm or more, and a tertiary amine compound, wherein a ratio of an adhesive force (A2) to an initial adhesive force (A1) is 50% or less, where the initial adhesive force (A1) is measured after heat-treating the adhesive layer at a temperature of 150° C. to 200° C. and the adhesive force (A2) is measured after light-irradiating the heat-treated adhesive layer.
(canceled)
Dependencies are inferred from the claim text.